Silicon wafer (single side polished), <100>, N (Phosphorous doped), diam. x thickness 50.8 mm x 280 μm

Silicon wafers / substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

SSC 180 - Silicon wafer (single side polished), <100>, N (Phosphorous doped), diam. x thickness 50.8 mm x 280 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.