Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 2 in x 280 μm

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

S 8687 (OTTO) Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 2 in x 280 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.