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Silicon wafers / substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 162 - Silicon wafer (single side polished), <100>, N (Phosphorous doped), diam. x thickness 76 mm x 380 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Notch filter, 532 nm, 12.5 mm
7440-21-3
Silicon substrate, single side polished, <111>, P-type, contains boron as dopant, diam. × thickness 50 mm × 1 mm
SOI wafers, 6 Inch, Dia 150 mm, P-type, Boron Doped
Broadband Non-Polarizing Cube Beam Splitters (50 mm x 50 mm x 50 mm)
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.