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Synonyms: Silicon substrate, single crystal, dia x thickness 2 in x 280 μm
Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 8699 (OTTO) Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 3 in x 500 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-21-3
Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm
12063-98-8
Gallium phosphide wafers, <111>, diam. x thickness 50.8mm. x 0.25 - 0.55 mm
Plano gold mirror, Dia 25 mm, Thick 6 mm
Single Crystal Electronic CVD diamond (3.0 x 3.0 mm, 0.30 mm thick) Type
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.