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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
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Half wave plate @ 633nm
22398-80-7
Indium phosphide substrates, <100>, semi insulating, contains iron as dopant, diam. × thickness 50.5 mm × 350 μm
Yttrium aluminium garnet, single crystals, <100>, 10 mm x 10 mm x 0.5 mm, 99.99%
Plano Concave Spherical Lens, Dia 25.4 mm, Focal Length -250 mm
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