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Material used = H-K9L
BK7-144 BK7 glass substrates, 25 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano Convex Lens, Dia 25.4 mm, Focal Length 92 mm
Glass wafers, diam. × thickness 3 in × 300 μm
Beam Expander (Magnification 3.0X )
1303-00-0
Gallium arsenide wafers, N-TYPE, dia 76.2 mm, thick 500 µm, <100>
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.