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Material used = H-K9L
BK7-144 BK7 glass substrates, 25 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Nd:YAG Laser Rods (1.1% Doping of Nd +3 ion)
7440-21-3
Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 100 mm x 500 µm
Plano Convex Spherical Lens, Focal Length : 500mm
7440-56-4
Germanium optical windows, 140 mm dia, 30 mm thick, 99.999%
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.