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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 6091 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-21-3
Silicon wafer (single side polished), <111>, P-type, contains boron as dopant, diam. x thickness 2 in. x 0.5 mm
Cadmium zinc telluride wafers 25mm x 25mm thick 1.2 mm
Plano Convex Lens, Dia 25.4 mm, Focal Length 50 mm
Mounted AR Coated Aspheric Lens (f = 50 mm)
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.