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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 6091 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Glass substrate, 10 x 10 mm, thick 1 mm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 30mm, AR @ 976 nm
Dichroic mirror (for 1064/532 nm) Dia 38 mm, Thickness 6 mm
Glass Wafers (100 mm x 100 mm x 0.2 mm)
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.